Samsung to begin HBM4 chip shipment later this month
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Samsung Electronics is expected to begin shipments of its next-generation high-bandwidth memory, HBM4, later this month. According to well-informed industry sources, the shipments are expected to occur after the Lunar New Year holiday. Samsung Electronics is also set to become the first memory maker to commercialize what is widely seen as a game-changing chip for AI computing, the sources added. The company has plans to start shipping HBM4 to Nvidia as early as the third week of February. Nvidia is expected to use the memory in its next-generation AI accelerator platform, Vera Rubin. Samsung set to begin HBM4 shipment this month The move signals a turn in fortune for Samsung, which had faced questions and criticisms over its competitiveness in earlier HBM generations. With the HBM4, Samsung is aiming to close the gap and even move ahead of crosstown rival SK Hynix, which had gained an early lead in the sector thanks to the surging demand from AI data centers. According to an industry official, the move gives Samsung the much-needed recovery it needed in the technology sector. The industry source also mentioned that by being the first to mass-produce the highest performance HBM4, it gives the company a clear advantage in shaping the market the way it wants. Nvidia is expected to unveil Vera Rubin accelerators incorporating the HBM4 at its annual conference, GTC 2026, which is expected to be held later this month. Samsung mentioned that the shipment timing was concluded after coordination with Nvidia’s product roadmap and downstream system-level testing schedules. Aside from speed, Samsung’s technological approach to the product is also notable. From the onset, the company planned to improve upon the standards set by JEDEC, adopting the industry’s first combination of a sixth-generation 10-nanometer-class DRAM (1c) process with a 4-nanometer logic die produced through its…
Filed under: News - @ February 8, 2026 11:24 am