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On Friday, SK Hynix completed the development of HBM4, its next-generation memory product for ultra-high-performance AI. The company also established a mass production system for the high-bandwidth memory chips for customers. The South Korean firm said the semiconductor chip vertically interconnects multiple DRAM chips and increases data processing speed compared to conventional DRAM products. The company believes that the mass production of the HBM4 chips will lead the AI industry.  SK Hynix prepares mass production of HBM4 SK Hynix developed its product based on the recent dramatic increase in AI demand and data processing, which requires high-bandwidth memory for faster system speed. The company also believes that securing memory power efficiency has become a key requirement for customers, as power consumption for data center operation has surged. The semiconductor supplier hopes that HBM4’s increased bandwidth and power efficiency will be the optimal solution to meet customers’ needs. The production of the next-generation of HBM4 involves stacking chips vertically to save space and reduce power consumption, which helps to process large volumes of data generated by complex AI applications. “Completion of HBM4 development will be a new milestone for the industry. By supplying the product that meets customer needs in performance, power efficiency and reliability in timely manner, the company will fulfill time to market and maintain a competitive position.” –Joohwan Cho, Head of HBM Development at SK Hynix. The South Korean company revealed that its new product has the industry’s best data processing speed and power efficiency. According to the report, the chip’s bandwidth has doubled from the previous generation by adopting 2,048 I/O terminals, and its power efficiency has surged by over 40%. SK Hynix also maintained that HBM4 will improve AI service performance by up to 69% when the product is applied. The initiative aims to solve data…

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Filed under: News - @ September 12, 2025 9:29 am